The operator inserts the component PAB board into the platform of the selective soldering machine, presses the start button, and the PCB board moves to the set position to spray the flux. After the flux is sprayed, the welding starts, and the welding is c
FS250 选择性喷雾焊锡机技术参数
FS250 Selective spray and soldering system
规格表 specifications | 参数 Parameter |
外型尺寸 Size | 880L*1040W*960H (mm) |
机器框架及外罩 Machine frame and cover | 铝型材框架+冷板喷粉 Aluminium extruded sections frame + Door |
作业高度 Operating height | 900±20mm |
重量 Weight | Approx.250KG |
电源 Power supply | 220V 50/60HZ |
总功率Total power | 6KW |
PCB 规格 PCB parameter | |
PCB 尺寸 PCB size | Max:350(L)*250(W)(mm) |
板面元件高度 Top component height |
Max180mm |
板底元件高度 Bottom component height |
Max30mm |
PCB 重量 PCB Weight | Max10Kg |
PCB 工艺边 PCB Process Edge | >3mm |
选点喷雾系统 Selective spray system | |
移动方式 Spray movement mode | PCB 于 XYZ 轴上移动 PCB movement in XYZ axis |
助焊剂容量 Spray flux volume |
130ml |
助焊剂添加方式 Spray flux add mode | 手动 Manual |
喷嘴类型 Spray nozzle type | 针状雾化 Needle |
喷雾节拍时间 Spray cycle time | 1 秒/点 1 Sec/ soldered dot |
喷雾移动精度 Spray movement precision |
0.05mm |
喷雾流量控制 Spray flow control | 减压表+限流阀 pressure gage + flow valve |
选择性焊接系统 Selective Soldering System | |
焊接移动方式 Welding movement mode | PCB 于 XYZ 轴上移动 PCB movement in XYZ axis |
移动方式 Movement mode | 步进马达+直线滑轨方式 Step motor + linear rail |
无铅锡添加方式 Solder feeding mode | 手动(可选项:自动) Manual( Option: auto) |
无铅锡容量 Solder capacity | 16KG |
熔锡时间 Solder melting time | 20min |
功率 Solder power | 3KW | |
焊接喷嘴规格 Solder nozzle size | 标配 D8mm,其余规格可选配 Standard D8mm, other sizes is option | |
焊接节拍时间 Solder cycle time | 5 秒/点 5 Sec/ soldered dot | |
控温方式 Temperature control mode |
PID+SSR | |
温度设定范围 Temperature setting range |
Max400OC | |
控温精度 Temperature accuracy |
±2OC | |
锡波高度 Waver height | Max 5mm | |
焊锡精度 Welding precision | 0.1mm | |
锡渣产生量 Solder dross | 0.2Kg/8H(无氮气保护);0.01Kg/8H(氮气保护) 0.2Kg/8H(Not N2 protection);0.01Kg/8H( N2 protection) | |
氮气保护系统 N2 protection system | ||
氮气保护方式 N2 protection mode | 喷嘴及熔锡液面 Nozzle and solder pot | |
氮气消耗量 N2 consumption |
2M3/h | |
氮气流量控制 N2 flow control | 数显流量控制 Digital flow control | |
外部抽风系统 Exhaust system | ||
顶罩式抽风 Top cover exhaust | 客户自配 Customer supply | |
抽风管数量 Exhaust quantity | 1 个 1 PCS | |
排风量 Exhaust volume | 约 5m³/h(由客户自配外接排风通道) About 5m³/h | |
控制系统 Control system | ||
控制方式 Control mode | 触摸屏+PLC Touch screen + PLC | |
PCB 制程参数 PCB Process parameter | 于触摸屏上设定、保存、调用 Setting, save , open in the touch screen | |
蜂鸣器 buzzer | 蜂鸣器提示作业完成 Prompt sound from the buzzer | |
其它 Other | PCB 产量计数功能、故障记录、报警记录可于触摸屏上调阅 PCB counting, message, alarm can be read in the touch screen | |
可选项 Option | ||
焊接实时监控Welding real-time monitoring | ||
扫码枪Sweep gun |
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