SDS250-II选择性焊接机技术参数
SDS250-II Selective Soldering System
规格表specifications | 参数Parameter | |
外型尺寸Size | 1050L*885W*1250H (mm) | |
机器框架及外罩 Machine frame and cover | 型材框架+冷板喷粉 Extruded sections frame + Door | |
作业高度Operating height | 900±20mm | |
重量Weight | Approx.350KG | |
电源Power supply | 3φ380V 50/60HZ | |
总功率Total power | 5.5KW | |
PCB规格 PCB parameter | ||
PCB尺寸 PCB size | Max:330(L)*250(W);Min: 100(L)*50(W)(mm) | |
板面元件高度 Top component height | Max100mm | |
板底元件高度 Bottom component height | Max15mm | |
PCB重量 PCB Weight | Max3Kg | |
PCB工艺边 PCB Process Edge | >3mm | |
选择性焊接系统Selective Soldering System | ||
焊接移动方式 Welding movement mode | PCB于XYZ轴上移动 PCB movement in XYZ axis | |
移动方式 Movement mode | 步进马达+直线滑轨方式 Step motor + linear rail | |
无铅锡添加方式 Solder feeding mode | 手动(可选项:自动) Manual( Option: auto) | |
无铅锡容量Solder capacity | 16KG | |
熔锡时间Solder melting time | 20min | |
功率 Solder power | 3KW | |
焊接喷嘴规格 Solder nozzle size | 标配D8mm,其余规格可选配 Standard D8mm, other sizes is option | |
焊接节拍时间 Solder cycle time | 3秒/点 3 Sec/ soldered dot | |
控温方式 Temperature control mode | PID+SSR | |
温度设定范围 Temperature setting range | Max400OC | |
控温精度 Temperature accuracy | ±1OC | |
锡波高度Waver height | Max 5mm | |
焊锡精度Welding precision | 0.1mm | |
锡渣产生量 Solder dross | 0.2Kg/8H(无氮气保护);0.01Kg/8H(氮气保护) 0.2Kg/8H(Not N2 protection);0.01Kg/8H( N2 protection) | |
推板机构Push PCB System | ||
推板方式 Push PCB mode | 步进马达+直线模组 Step motor + linear rail model | |
推板位置设定 Position of PCB output | 可于触摸屏上设定 Can be set in the touch screen | |
氮气保护系统 N2 protection system | ||
氮气保护方式 N2 protection mode | 喷嘴及熔锡液面 Nozzle and solder pot | |
氮气消耗量 N2 consumption | 2M3/h | |
氮气流量控制 N2 flow control | 数显流量控制 Digital flow control | |
外部抽风系统Exhaust system | ||
顶罩式抽风 Top cover exhaust | 客户自配 Customer supply | |
抽风管数量 Exhaust quantity | 1个 1 PCS | |
排风量 Exhaust volume | 约5m³/h(由客户自配外接排风通道) About 5m³/h | |
其它Other | ||
PCB送入方式 PCB entry mode | 手动推入 Manual operation | |
控制系统Control system | ||
控制方式 Control mode | 触摸屏+PLC Touch screen + PLC | |
PCB制程参数 PCB Process parameter | 于触摸屏上设定、保存、调用 Setting, save , open in the touch screen | |
其它 Other | PCB产量计数功能、故障记录、报警记录可于触摸屏上调阅 PCB counting, message, alarm can be read in the touch screen | |
可选项Option | ||
作业高度Operating height 750±20mm | ||
焊接时锡炉于XYZ轴上移动,PCB固定 Soldering pot move in XYZ axes and PCB fixedly |
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